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Science and Technology of Semiconductor Surface Preparation

Science and Technology of Semiconductor Surface Preparation

Volume 477

$31.99 (C)

Part of MRS Proceedings

  • Date Published: September 1997
  • availability: Temporarily unavailable - available from TBC
  • format: Hardback
  • isbn: 9781558993815

$ 31.99 (C)

Temporarily unavailable - available from TBC
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About the Authors
  • The focus of semiconductor wafer processing is rapidly changing. Pure device performance is no longer sufficient to ensure a technology's success as IC chips approach 1GB. Yield, reliability, cost and manufacturability are principal drivers of the industry. Great strides have been made in understanding the science and impact of front-end (pre-metal) chemical surface preparations and are beginning to influence the 'real' technology and its evolution. Efforts in understanding particle and metals removal, along with Si surface etching and microroughness are prime examples of areas where work is beginning to pay off together with processes related to the back-end (post-metal). The focus of this book is to report new findings and to discuss surface preparation with an emphasis on gaining a mechanistic understanding of the underlying science upon which the technology is based. Topics include: megasonic cleaning; SC1 technology; surface preparation and gate oxide reliability; CMP/CMP cleaning; post-etch processing; surface microroughness; wet chemical cleaning and gate oxide integrity; analytical studies of surfaces; wet chemical cleaning/etching; dry wafer cleaning; and environmentally friendly processing.

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    Product details

    • Date Published: September 1997
    • format: Hardback
    • isbn: 9781558993815
    • weight: 0.909kg
    • availability: Temporarily unavailable - available from TBC
  • Editors

    Gregg S. Hagashi, Bell Laboratories, Lucent Technologies, Orlando

    Masataka Hirose, Hiroshima University, Japan

    Srini Ragahavan, University of Arizona

    Steven Verhaverbeke, CFM Technologies, West Chester

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